SHPE Foundation

General Scholarships

The 2014-2015 SHPE Foundation Scholarship Application is closed.

APPLICATION INSTRUCTIONS

  1. Complete the online scholarship application.
  2. Print a copy of the Scholarship Application Page, after you submit your applicationfor your records).
  3. Download the Scholarship Certification Form from the SHPE Foundation website.
  4. Mail the Scholarship Certification Form, Official Transcript, Resume and Letter of Recommendation to SHPE Foundation postmarked by May 1, 2014.
  5. Mail Scholarship Certification Form, Official Transcript, Resume and Letter Recommendation to(new address):
    SHPE Foundation
    General Scholarships
    1765 Duke St. 
    Alexandria, VA 22314

DESCRIPTION

Merit-based and need-based general scholarships are awarded, in the amount of $1,000 - $3,000, to qualified high school graduating seniors, undergraduate students, and graduate students who demonstrate both significant motivation and aptitude for a career in science, technology, engineering or mathematics.

ELIGIBILITY

  • Must be a SHPE member to apply (You can become a SHPE member before you apply for scholarship: High school students please click here. Undergraduate and Graduate students please click here)
  • Hispanic-descent (preferred)
  • U.S. citizenship is not required.
  • Be accepted into or attending an accredited 2-year or 4-year college or university in the United States or Puerto Rico.
  • Be enrolled full-time (12 hrs undergraduate, 9 hrs graduate) during the academic year. High school graduating seniors must be graduating from an accredited U.S. high school with a diploma.
  • Minimum GPA: 2.75 on a 4.0 for high school seniors and undergraduates; 3.00 on a 4.0 scale for graduate students.
  • Major in science, technology, engineering, mathematics or a related field.
  • Be pursuing your first bachelors, masters or doctoral degree. (Students pursuing a second bachelors, etc. are not eligible).

APPLICATION MATERIALS

The SHPE Foundation Scholarship application includes all of the following:

DEADLINE

The applicant must submit the application materials as a single, complete package postmarked by May 1, 2014. No materials will be accepted by fax or email.