SHPE Foundation

Professional Scholarship

SCHOLARSHIP APPLICATION DEADLINE: Postmarked by May 1.

Scholarship recipients will be notified in mid-August. In order to best serve our students, please do not contact the office until late August if you have not received notice of your application status.

APPLICATION INSTRUCTIONS

  1. Complete the online scholarship application.
  2. Print a copy of the Scholarship Application Page, after you submit your application.
  3. Download the Scholarship Certification Form from the SHPE Foundation Web site.
  4. Mail the Scholarship Certification Form, Official Transcript, Resume and Letter of Recommendation to SHPE Foundation postmarked by May 1.
  5. Mail the application, official Transcript and résumé to:

    THE SHPE Foundation, Inc.
    Professional Scholarship
    P.O. Box 93577
    City of Industry, CA 91715

DESCRIPTION

Merit-based scholarships awarded, in the amount of $2,000, to SHPE professionals, who demonstrate significant motivation in pursuing their graduate education.

ELIGIBILITY

  • Must be a SHPE member to apply (You can become a SHPE member before you apply for scholarship: High school students please click here. Undergraduate and Graduate students please click here)
  • Be employed full-time in the U.S. or Puerto Rico in a technical career field.
  • Be enrolled in a science, technology, engineering, mathematics graduate degree program at an accredited university in the United States or Puerto Rico at least half-time (6 hrs/credits) throughout the academic year.
  • Have a minimum 3.25 on a 4.0 GPA
  • Must be a SHPE member to apply
  • Be a SHPE member in good standing both at the time of application and throughout the academic year. (Non-member professionals may become members at the time of application).
  • Must be pursuing a first masters or doctoral degree. Individuals pursuing a second, third, etc. masters or doctoral degree of any type are ineligible.

APPLICATION MATERIALS

The SHPE Foundation Scholarship application includes all of the following:

DEADLINE

The applicant must submit the application materials as a single, complete package postmarked by May 1. No materials will be accepted by fax or email.