AHETEMS - Advancing Hispanic Excellence in Technology, Engineering, Math and Science

AHETEMS Professional Scholarship

AHETEMS SCHOLARSHIP APPLICATION DEADLINE: Postmarked by April 1.

Scholarship recipients will be notified in mid-August. In order to best serve our students, please do not contact the office until late August if you have not received notice of your application status.

APPLICATION INSTRUCTIONS

  1. Print a copy of the Scholarship Application Page, after you submit your application.
  2. Download the Scholarship Certification Form from the AHETEMS Web site.
  3. Mail the Scholarship Certification Form, Official Transcript, Resume and Letter of Recommendation to AHETEMS postmarked by April 1.
  4. Mail the application to:
    AHETEMS, Inc.
    c/o: 2010-11 Scholarship Program
    University of Texas at Arlington, Box 19019
    416 Yates Street, Room 609
    Arlington, TX

DESCRIPTION

Merit-based scholarships awarded, in the amount of $2,000, to SHPE professionals, who demonstrate significant motivation in pursuing their graduate education.

ELIGIBILITY

  • Be employed full-time in the U.S. or Puerto Rico in a technical career field.
  • Be enrolled in a science, technology, engineering, mathematics graduate degree program at an accredited university in the United States or Puerto Rico at least half-time (6 hrs/credits) throughout the academic year.
  • Have a minimum 3.25 on a 4.0 GPA
  • Be a SHPE member in good standing both at the time of application and throughout the academic year. (Non-member professionals may become members at the time of application).
  • Must be pursuing a first masters or doctoral degree. Individuals pursuing a second, third, etc. masters or doctoral degree of any type are ineligible.

APPLICATION MATERIALS

The AHETEMS Scholarship application includes all of the following:

  • Scholarship Certification Form
  • Personal Statement (Which can be completed online as part of online application)
  • Transcript
  • Recommendation Letter
  • Resume

DEADLINE

The applicant must submit the application materials as a single, complete package postmarked by April 1. No materials will be accepted by fax or email.